Our proprietary compounding technique has enabled adhesion and separation of this functional material.
Because of its high adhesiveness in a wide range of temperatures and its ease of separation, it is being applied to semiconductor packaging process materials.
Temporary adhesive which has excellent high adhesion force over a wide range of temperatures and easy separation.
■Temporary adhesive has high adhesion force at high temperature(above 180℃).
■Temporary adhesive has 2 separation methods.
(Hot-melt type and UV separation type)
■Residue after separation can be easily removed by solvent.
|Maximum use temperature||Separation temperature||Solubility of
|UV separation type||≧180℃||≦150℃||Excellent|
R&D Headquarters Advanced Materials Planning
TEL. +81 (0)3-6711-8162