Temporary adhesive

Temporary adhesive

Our proprietary compounding technique has enabled adhesion and separation of this functional material.
Because of its high adhesiveness in a wide range of temperatures and its ease of separation, it is being applied to semiconductor packaging process materials.

Temporary adhesive which has excellent high adhesion force over a wide range of temperatures and easy separation.

features

Temporary adhesive has high adhesion force at high temperature(above 180℃).
Temporary adhesive has 2 separation methods.
  (Hot-melt type and UV separation type)
Residue after separation can be easily removed by solvent.

Temporary
adhesive
Maximum use temperature Separation temperature Solubility of
residue
Hot-melt type 160℃ 220℃ Good
UV separation type ≧180℃ ≦150℃ Excellent

Adhesion, Separation―temperature

Adhesion, Separation―temperature

Contact
Daicel Corporation
R&D Headquarters Advanced Materials Planning
TEL. +81 (0)3-6711-8162