Solvent for Electronic Materials

Daicel’s functional solvents go on smoothly, cleanly and evenly, whether coated or printed, because drying speed and solubility are carefully controlled1) by mixing and matching various solvents of high boiling point (over 15 of which are our own) with other types of solvent. They are being used as conductive paste and insulating ink with coated and printed electronic components like laminated ceramic capacitors. 

  • Controlled characteristics: Boiling point, solubility, rheology
    Ex.: Boiling point range Daicel’s products 70 – 260℃, Competitor products 70 – 180℃

CELTOL® (High-performance Solvents for Electronic Device Manufacture)

CELTOL® is a registered trademark of the Daicel Group.

Daicel offers other solvents not shown in this catalog.

wipe the screen to view more.

Abbreviation Chemical name Structual formula CAS No. Boiling point
℃
(760mmHg)		 Flash point
℃		 Solubility
parameter
(cal/cm3)1/2
(Hansen)		 Solubility
in water
g/100g		 Surface
tension
dyn/cm
(25℃)		 Viscosity
mPa･s
(25℃)		 Examples of use ENCS
(Japan)		 KECL
(South
Korea)		 TCSI
(Taiwan)		 IECSC
(China)
DMM Dipropylene Glycol
Dimethyl Ether		 Structual formula: DMM 11109-77-4 175 60 8.4 53 25.9 1
  • Photoresist for display
  • Inkjet ink
 (7)-1321 97-3-442 Existing Existing
PGDA Propylene Glycol Diacetate Structual formula: PGDA 623-84-7 190 93 9.3 8 31.2 2.7
  • Metal paste for MLCC
  • Photoresist for display
 (2)-665 KE-29272 Existing Existing
DPMNP Dipropylene Glycol
Methyl n-Propyl Ether 		Structual formula: DPMNP 150407-54-8 203 74 8.2 2.5 25.2 1.4
  • Metal paste for MLCC
 (7)-1321 Registered Registered None
DPMA Dipropylene Glycol
Methyl Ether Acetate		 Structual formula: DPMA 88917-22-0 213 98 8.8 19 28.6 1.7
  • Photoresist for display
 (2)-3928 KE-12228 Existing Existing
DPMNB Dipropylene Glycol
Methyl n-Butyl Ether		 Structual formula: DPMNB 106002-01-1 227 94 8.2 0.5 25.6 1.5
  • Metal paste for MLCC
 (7)-1321 None Registered None
1,4-BDDA 1,4-Butanediol Diacetate Structual formula: 1,4-BDDA 628-67-1 232 116 9.2 4.4 34.2 3.1
  • Photoresist for display
  • Inkjet ink
 (2)-2538 KE-03791 Existing None
1,3-BGDA 1,3-Butylene Glycol Diacetate Structual formula: 1,3-BGDA 1117-31-3 232 100 9.2 5 31.4 2.9
  • Photoresist for display
  • Metal paste
 (2)-2538 KE-03790 Existing Existing
1,6-HDDA 1,6-Hexanediol Diacetate Structual formula: 1,6-HDDA 6222-17-9 260 138 9 0.6 34.1 3.9
  • Semiconductor material
  • Photoresist for display
 (2)-3706 KE-19693 Existing None

The solvents shown above are industrial products. We also offer developed products. Please contact us for details.

Solvents List

For improved solubility, coating performance, and drying performance, we offer CELTOL®. For your information please see the applicable tables.

Acetate

wipe the screen to view more.

Abbreviation Chemical name Structual formula CAS No. Boiling point
℃
(760mmHg)		 Flash point
℃		 Solubility
parameter
(cal/cm3)1/2
(Hansen)		 Solubility
in water
g/100g		 Surface
tension
dyn/cm
(25℃)		 Viscosity
mPa･s
(25℃)		 Examples of use ENCS
(Japan)		 KECL
(South
Korea)		 TCSI
(Taiwan)		 IECSC
(China)
MA Methyl Acetate Structual formula: MA 79-20-9 56 -15.5 9.2 24.4 23.9 0.4
  • Coatings/Inks
 (2)-725 KE-23405 Existing Existing
AE Ethyl Acetate Structual formula: AE 141-78-6 77 -4 8.8 9 23.2 0.4
  • Coatings/Inks
 (2)-726 KE-00047 Existing Existing
IPAC Isopropyl Acetate Structual formula: IPAC 108-21-4 85 7.7 8.3 3 21.7 0.5
  • Pharmaceuticals/Industrial Applications
 (2)-727 KE-21670 Existing Existing
NPAC n-Propyl Acetate Structual formula: NPAC 109-60-4 102 15.2 8.6 2 23.8 0.5
  • Coatings/Inks
 (2)-727 KE-29778 Existing Existing
BA Butyl Acetate Structual formula: BA 123-86-4 128 28.2 8.5 2 24.3 0.7
  • Coatings/Inks
 (2)-731 KE-04179 Existing Existing
MMPGAC Propylene Glycol Monomethyl
Ether Acetate		 Structual formula: MMPGAC 108-65-6 146 47.7 8.9 16 26.7 1.1
  • Photoresist for semiconductors/display
  • LC/Semiconductor Materials

Semiconductor-specific grades available

 (2)-3144 KE-23315 Existing Existing
MBA 3-Methoxybutyl Acetate Structual formula: MBA 4435-53-4 171 62.5 8.8 7 27.9 1.2
  • Photoresist for semiconductors/display
  • LC/Semiconductor Materials
 (2)-739 KE-23237 Existing Existing
DRA-150 Triacetin Structual formula: DRA-150 102-76-1 260 148 9.8 8 35.2 17.5
  • Coatings/Inks
 (2)-753 KE-29332 Existing Existing

Alcohol

wipe the screen to view more.

Abbreviation Chemical name Structual formula CAS No. Boiling point
℃
(760mmHg)		 Flash point
℃		 Solubility
parameter
(cal/cm3)1/2
(Hansen)		 Solubility
in water
g/100g		 Surface
tension
dyn/cm
(25℃)		 Viscosity
mPa･s
(25℃)		 Examples of use ENCS
(Japan)		 KECL
(South
Korea)		 TCSI
(Taiwan)		 IECSC
(China)
MMPG Propylene Glycol
Monomethyl Ether		 Structual formula: MMPG 107-98-2 121 32.3 11 ∞ 27.7 1.7
  • Photoresist for semiconductors/display
  • LC/Semiconductor Materials
 (2)-404 KE-23379 Existing Existing
MB 3-Methoxybutanol Structual formula: MB 2517-43-3 161 64.5 10.6 ∞ 28.9 2.9
  • Photoresist for display
  • LC/Semiconductor Materials
 (2)-409 KE-23232 Existing Existing
1,3-BG 1,3-Butylene Glycol Structual formula: 1,3-BG 107-88-0 208 121 14.2 ∞ 36.1 95
  • Cosmetics Applications
 (2)-235 KE-03787 Existing Existing

Resale products

wipe the screen to view more.

Abbreviation Chemical name Structual formula CAS No. Boiling point
℃
(760mmHg)		 Flash point
℃		 Solubility
parameter
(cal/cm3)1/2
(Hansen)		 Solubility
in water
g/100g		 Surface
tension
dyn/cm
(25℃)		 Viscosity
mPa･s
(25℃)		 Examples of use ENCS
(Japan)		 KECL
(South
Korea)		 TCSI
(Taiwan)		 IECSC
(China)
EDGAC Diethylene Glycol
Monoethyl Ether Acetate		 Structual formula: EDGAC 112-15-2 216 105 9 ∞ 30.9 2.5
  • Coatings/Inks
  • Inkjet ink
 (2)-744 KE-10468 Existing Existing
BDGAC Diethylene Glycol
Monobutyl Ether Acetate		 Structual formula: BDGAC 124-17-4 247 124 8.7 7 29.7 3.1
  • Coatings/Inks
  • Inkjet ink
 (2)-744 KE-04138 Existing Existing
BMGAC Ethylene Glycol
Monobutyl Ether Acetate		 Structual formula: BMGAC 112-07-2 188 83 8.7 1 27.4 1.6
  • Coatings/Inks
  • Inkjet ink
 (2)-740 KE-04135 Existing Existing
NPR n-Propanol Structual formula: NPR 71-23-8 97 24 11.8 ∞ 23.3 1.9
  • Coatings/Inks
 (2)-207 KE-29362 Existing Existing
EDG Diethylene Glycol
Monoethyl Ether		 Structual formula: EDG 111-90-0 202 97 10.9 ∞ 31.3 3.9
  • Coatings/Inks
 (2)-422 KE-10467 Existing Existing

The solvents shown above are for coatings, inks, cleaning agents, FPD (CF, BM, overcoat, etc.), electronic paper, organic EL, inoganic EL, semiconductors, laminated components, solar batteries, organic TFT, RFID element formations (Examples of use: Conductors, semiconductors, insulators (dielectric) inks, electrolyte solutions, lubricants, pretreatment materials for washing, activation, inactivation.)